1. Project summary
The objective of the project is the development of smart, high-integration,
mechanically flexible electronic systems, for a wide variety of applications.
“Smart” means that the flexible multilayer laminate has embedded components,
and that the different flex layers in the multilayer structure can have
different functions, meaning that it might be necessary to combine layers of
different base material in the laminate. Compactness of the resulting circuit
will be boosted in two ways : by using the third dimension for electronic
component integration (not only on front and back side, but potentially on
every conductive layer) and by drastically increasing the wiring density through the
introduction of new flex manufacturing and lamination techniques. Innovative
technologies to be developed in SHIFT include
- a new, cheap flex laminate technology, based on a process for electroless Cu deposition on polyimide
- a new lamination technology, based on interconnection by solid state diffusion
- component embedding technologies : resistors, capacitors, RF components and ultrathin (20 micron) chips
- assembly technologies on embedded multilayer flex
The rationale of the project is that in order to realise the "ambient
intelligence" vision, more and more electronics systems will accompany
the citizen. For these systems there is a trend towards increased functionality,
compactness, wearability and reduced weight. The system may not hamper the mobility
of the human carrier. Flexible electronics systems take the shape of the object onto
or into which they are placed and may become quasi non-noticeable to the user.
Compared to their rigid board counterparts they show a drastic increase of comfort
for the user, and therefore the trend is starting and will become only stronger towards
the use of "smart" comfortable mechanically flexible electronic systems.
The aim of SHIFT is precisely to develop enabling technologies for such complex
flexible electronic systems.
